2019
Speakers Gallery – “The Future of Machine Learning” Conference with MIDAS Ireland, Qualcomm & UCC
The Speakers at “The Future of Machine Learning” Conference in association with MIDAS Ireland, Qualcomm and UCC, held in Cork on 19th February 2019.
Q1 Jan Feb Mar
Tyndall and Arralis sign €400,000 Research deal to develop a High – Volume Manufacturing Process for scaling mmWave Integration and Packaging Technologies
New mmWave HVM Process to be developed by Arralis and Tyndall Cork and Limerick, 19 February 2019: Leading Irish tech manufacturer, Arralis, has entered into a €400k research development agreement with Tyndall National Institute, to develop a next generation mmWave Read more…
2019
yieldHUB are delighted to announce the launch of their latest innovation yieldHUB Characterize.
New capability announced: yieldHUB Characterize yieldHUB are a fast growing member of MIDAS. For many years they have been providing Yield Management solutions to several MIDAS members including to Decawave in Dublin, Microchip in Ennis and On Semi in Cork Read more…
2018
2018 MIDAS Ireland Life Achievement Award Recipient: Mr. Ray Stata of Analog Devices
MIDAS Ireland is pleased to announce that the recipient of this years ‘Lifetime Achievement Award’ is Ray Stata of Analog Devices. The award was accepted on Ray’s behalf by Yusuf Jamal SVP, Analog Devices (L) from Leonard Hobbs, Chairperson, MIDAS Ireland (R) Read more…
2018
Announcing the MIDAS Electronic Project Competition 2019 – Sponsored by Analog Devices
The Microelectronics Industry Design Association of Ireland (MIDAS) wishes to foster excellence in electronic and microelectronic design and development. To that end MIDAS wishes to announce a competition open to all students studying electrical, electronic or microelectronic engineering in 3rd Read more…
2018
Cypress Semiconductor opens new Dublin Office
The new Cypress Semiconductor office in Dublin was officially opened on 7th November 2018. The office was opened by Sudhir Gopalswamy, Executive VP of the Microcontroller & Connectivity Division