Duolog to Present IP-XACT Solution to Increase IP Quality through Register Management at ARM TechCon

Duolog Technologies, the award-winning developer of IP and SoC integration products, has been selected to present a technical paper at ARM TechCon. The presentation highlights how Duolog’s Socrates integration applications interoperate with Cadence Incisive Enterprise Simulator products to demonstrate register management as a fully mature IP methodology.


Analog Devices, Inc. (ADI) introduced today two fully programmable jitter attenuating clock translators ICs (integrated circuits) that perform frequency translations for a wide range of wired communications applications — including Synchronous Ethernet and SONET/SDH optical networks — that require low jitter, fast time to market and cost effectiveness.

New Microwave PLL Synthesizer Eliminates Frequency-doubling in Broadband, Point-to-Point and Multipoint Wireless Applications

Analog Devices, Inc. (ADI), a global leader in high-performance signal processing technology and leading provider of RF ICs, today introduced a PLL (phase-locked loop) frequency synthesizer that can be used to implement local oscillators as high as 18 GHz in the up-conversion and down-conversion sections of wireless receivers and transmitters.

Analog Devices’ Quadrature Demodulators Offer Unprecedented Levels of Dynamic Range and Integration

Analog Devices, Inc. (ADI) today introduced the ADRF6806 and ADRF6807 quadrature demodulators featuring the industry’s highest dynamic range and integration, which cover a wide range of IF frequencies used in QAM / QPSK receivers as well as supporting common cellular standards such as W-CDMA / CDMA2000 / LTE, and also microwave point-to-point and point-to-multi-point radio architectures.

Analog Devices Introduces First Digital Isolator Packaging that Meets Safety Requirements in Medical and Industrial Applications

Analog Devices, Inc. (ADI), a global leader in high-performance semiconductors for signal-processing applications, has introduced the first packaging technology for digital isolators that achieves a minimum of 8-mm creepage distance required by global industry standards to ensure safe operation in high-voltage medical and industrial applications.